USPC Class Details

Description: 216 etching a substrate: processes / 216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched

Hierarchy/Derived subclasses

216 / 58	-> 63	-> 64
		-> 65
		-> 66
		-> 67	-> 68
			-> 69	-> 70
			-> 71

uspto searches

Patent Apps in 216/63

Granted Patents in 216/63

Use the links above or do an advanced search in ppubs for:
(216/63.ccls. or 216/64.ccls. or 216/65.ccls. or 216/66.ccls. or 216/67.ccls. or 216/68.ccls. or 216/69.ccls. or 216/70.ccls. or 216/71.ccls.)

This will show what classes derive from the input. Ex: entering 43/42.24 shows the derived classes and the search that can be used to find patents or patent applications in those subclasses.

Display:

Back