USPC Class Details

Description: 216 etching a substrate: processes / 216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (67) using plasma (68) using coil to generate the plasma

Hierarchy/Derived subclasses

216 / 58-> 63-> 67-> 68

uspto searches

Patent Apps in 216/68

Granted Patents in 216/68

Use the links above or do an advanced search in ppubs for:
(216/68.ccls.)

This will show what classes derive from the input. Ex: entering 43/42.24 shows the derived classes and the search that can be used to find patents or patent applications in those subclasses.
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