USPC Class Details

Description: 438 semiconductor device manufacturing: process / 438 semiconductor device manufacturing: process/(106) packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor (118) including adhesive bonding step (119) electrically conductive adhesive

Hierarchy/Derived subclasses

438 / 106

-> 118

-> 119

uspto searches

Patent Apps in 438/119

Granted Patents in 438/119

Use the links above or do an advanced search in ppubs for:
(438/119.ccls.)

This will show what classes derive from the input. Ex: entering 43/42.24 shows the derived classes and the search that can be used to find patents or patent applications in those subclasses.

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