cpc classification details H01L23/04

Description: (23/00) Details of semiconductor or other solid state devices H01L25/00 takes precedence ; structural arrangements for testing or measuring during manufacture or treatment, or for reliability measurements H01L22/00; arrangements for connecting or disconnecting semiconductor or solid-state bodies, or methods related thereto H01L24/00; finger print sensors G06K9/00006 (23/02) Containers (23/04) characterised by the shape of the container or parts, e.g. caps, walls

Indent level: 2

classification definition: H01L 23/04

Hierarchy/Derived classifications

H01L23/00	-> 23/02	-> 23/04	-> 23/041
			-> 23/043	-> 23/045
				-> 23/047
				-> 23/049
				-> 23/051
			-> 23/053	-> 23/055
				-> 23/057

uspto searches

Patent Apps in H01L23/04

Granted Patents in H01L23/04

Advanced search in patft or appft for the hierarchy would be:
(cpc/H01L23/00 or cpc/H01L23/02 or cpc/H01L23/04 or cpc/H01L23/041 or cpc/H01L23/043 or cpc/H01L23/045 or cpc/H01L23/047 or cpc/H01L23/049 or cpc/H01L23/051 or cpc/H01L23/053 or cpc/H01L23/055 or cpc/H01L23/057)

This will show what classifications derive from the input. Ex: entering A01B 3/36 shows the derived classifications and the search that can be used to find patents or patent applications in those classifications.

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