cpc classification details H01L23/04
Description: (23/00) Details of semiconductor or other solid state devices H01L25/00 takes precedence ; structural arrangements for testing or measuring during manufacture or treatment, or for reliability measurements H01L22/00; arrangements for connecting or disconnecting semiconductor or solid-state bodies, or methods related thereto H01L24/00; finger print sensors G06K9/00006 (23/02) Containers (23/04) characterised by the shape of the container or parts, e.g. caps, walls
Indent level: 2
classification definition:
H01L 23/04
Hierarchy/Derived classifications
uspto searches
Patent Apps in H01L23/04
Granted Patents in H01L23/04
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(cpc/H01L23/00 or cpc/H01L23/02 or cpc/H01L23/04 or cpc/H01L23/041 or cpc/H01L23/043 or cpc/H01L23/045 or cpc/H01L23/047 or cpc/H01L23/049 or cpc/H01L23/051 or cpc/H01L23/053 or cpc/H01L23/055 or cpc/H01L23/057)
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