USPC Patent Classifications

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Class 216 etching a substrate: processes
uspcdescription
216/2216 etching a substrate: processes/(2) etching of semiconductor material to produce an article having a nonelectrical function
216/3216 etching a substrate: processes/(3) forming or treating josephson junction article
216/4216 etching a substrate: processes/(4) forming or treating a sign or material useful in a sign
216/5216 etching a substrate: processes/(4) forming or treating a sign or material useful in a sign (5) sign or material is electroluminescent
216/6216 etching a substrate: processes/(6) forming or treating material useful in a capacitor
216/7216 etching a substrate: processes/(7) forming or treating fibrous article or fiber reinforced composite structure
216/8216 etching a substrate: processes/(8) forming or treating cylindrical or tubular article having pattern or design on its surface
216/9216 etching a substrate: processes/(8) forming or treating cylindrical or tubular article having pattern or design on its surface (9) forming or treating an embossing cylinder or tubular article
216/10216 etching a substrate: processes/(8) forming or treating cylindrical or tubular article having pattern or design on its surface (10) forming or treating liquid transfer cylinder or tubular article (e.g., printing roll, etc.)
216/11216 etching a substrate: processes/(11) forming or treating an article whose final configuration has a projection
216/12216 etching a substrate: processes/(12) forming or treating mask used for its nonetching function (e.g., shadow mask, x-ray mask, etc.)
216/13216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.)
216/14216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (14) forming or treating lead frame or beam lead
216/15216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (15) forming or treating a crossover
216/16216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (16) forming or treating resistive material
216/17216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (17) forming or treating of groove or through hole
216/18216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (17) forming or treating of groove or through hole (18) filling or coating of groove or through hole with a conductor to form an electrical interconnection
216/19216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (17) forming or treating of groove or through hole (19) filling or coating of groove or through hole in a conductor with an insulator
216/20216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (20) adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)
216/21216 etching a substrate: processes/(13) forming or treating electrical conductor article (e.g., circuit, etc.) (21) repairing circuit
216/22216 etching a substrate: processes/(22) forming or treating article containing magnetically responsive material
216/23216 etching a substrate: processes/(23) forming or treating article containing a liquid crystal material
216/24216 etching a substrate: processes/(24) forming or treating optical article
216/25216 etching a substrate: processes/(24) forming or treating optical article (25) phosphor screen
216/26216 etching a substrate: processes/(24) forming or treating optical article (26) lens
216/27216 etching a substrate: processes/(27) forming or treating thermal ink jet article (e.g., print head, liquid jet recording head, etc.)
216/28216 etching a substrate: processes/(28) forming or treating an ornamented article
216/29216 etching a substrate: processes/(28) forming or treating an ornamented article (29) wood surface treated or wood grain produced
216/30216 etching a substrate: processes/(28) forming or treating an ornamented article (30) treating stone (e.g., marble, etc.)
216/31216 etching a substrate: processes/(28) forming or treating an ornamented article (31) treating glass (e.g., mirror, etc.)
216/32216 etching a substrate: processes/(28) forming or treating an ornamented article (32) treating elemental metal or alloy thereof
216/33216 etching a substrate: processes/(33) adhesive or autogenous bonding of two or more self-sustaining preforms wherein at least two of the preforms are not intended to be removed (e.g., prefabricated base, etc.)
216/34216 etching a substrate: processes/(33) adhesive or autogenous bonding of two or more self-sustaining preforms wherein at least two of the preforms are not intended to be removed (e.g., prefabricated base, etc.) (34) etching improves or promotes adherence of preforms being bonded
216/35216 etching a substrate: processes/(33) adhesive or autogenous bonding of two or more self-sustaining preforms wherein at least two of the preforms are not intended to be removed (e.g., prefabricated base, etc.) (34) etching improves or promotes adherence of preforms being bonded (35) bonding of preform of metal or an alloy thereof to a preform of a nonmetal
216/36216 etching a substrate: processes/(33) adhesive or autogenous bonding of two or more self-sustaining preforms wherein at least two of the preforms are not intended to be removed (e.g., prefabricated base, etc.) (36) removing at least one of the self-sustaining preforms or a portion thereof
216/37216 etching a substrate: processes/(37) etching and coating occur in the same processing chamber
216/38216 etching a substrate: processes/(38) planarizing a nonplanar surface
216/39216 etching a substrate: processes/(39) forming groove or hole in a substrate which is subsequently filled or coated
216/40216 etching a substrate: processes/(40) forming pattern using lift off technique
216/41216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist)
216/42216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (42) resist material applied in particulate form or spray
216/43216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (43) adhesively bonding resist to substrate
216/44216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (44) mechanically forming pattern into a resist
216/45216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (45) mask is reusable (i.e., stencil)
216/46216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (46) masking of sidewall
216/47216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (47) mask is multilayer resist
216/48216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (48) mask is exposed to nonimaging radiation
216/49216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (49) mask resist contains organic compound
216/50216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (49) mask resist contains organic compound (50) mask resist contains a color imparting agent
216/51216 etching a substrate: processes/(41) masking of a substrate using material resistant to an etchant (i.e., etch resist) (51) mask resist contains inorganic material
216/52216 etching a substrate: processes/(52) mechanically shaping, deforming, or abrading of substrate
216/53216 etching a substrate: processes/(52) mechanically shaping, deforming, or abrading of substrate (53) nongaseous phase etching
216/54216 etching a substrate: processes/(54) pattern or design applied by transfer
216/55216 etching a substrate: processes/(55) heating or baking of substrate prior to etching to change the chemical properties of substrate toward the etchant
216/56216 etching a substrate: processes/(56) etching to produce porous or perforated article
216/57216 etching a substrate: processes/(57) gas phase and nongaseous phase etching on the same substrate
216/58216 etching a substrate: processes/(58) gas phase etching of substrate
216/59216 etching a substrate: processes/(58) gas phase etching of substrate (59) with measuring, testing, or inspecting
216/60216 etching a substrate: processes/(58) gas phase etching of substrate (59) with measuring, testing, or inspecting (60) by optical means or of an optical property
216/61216 etching a substrate: processes/(58) gas phase etching of substrate (59) with measuring, testing, or inspecting (61) by electrical means or of an electrical property
216/62216 etching a substrate: processes/(58) gas phase etching of substrate (62) irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to etching to change properties of substrate toward the etchant
216/63216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched
216/64216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (64) etchant is devoid of chlorocarbon or fluorocarbon compound (e.g., c.f.c., etc.)
216/65216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (65) using laser
216/66216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (66) using ion beam, ultraviolet, or visible light
216/67216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (67) using plasma
216/68216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (67) using plasma (68) using coil to generate the plasma
216/69216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (67) using plasma (69) using microwave to generate the plasma
216/70216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (67) using plasma (69) using microwave to generate the plasma (70) magnetically enhancing the plasma
216/71216 etching a substrate: processes/(58) gas phase etching of substrate (63) application of energy to the gaseous etchant or to the substrate being etched (67) using plasma (71) specific configuration of electrodes to generate the plasma
216/72216 etching a substrate: processes/(58) gas phase etching of substrate (72) etching a multiple layered substrate where the etching condition used produces a different etching rate or characteristic between at least two of the layers of the substrate
216/73216 etching a substrate: processes/(58) gas phase etching of substrate (73) etching vapor produced by evaporation, boiling, or sublimation
216/74216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate
216/75216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (75) substrate contains elemental metal, alloy thereof, or metal compound
216/76216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (75) substrate contains elemental metal, alloy thereof, or metal compound (76) etching of substrate containing at least one compound having at least one oxygen atom and at least one metal atom
216/77216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (75) substrate contains elemental metal, alloy thereof, or metal compound (77) etching of substrate containing elemental aluminum, or an alloy or compound thereof
216/78216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (75) substrate contains elemental metal, alloy thereof, or metal compound (78) etching of substrate containing elemental copper, or an alloy or compound thereof
216/79216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (79) etching silicon containing substrate
216/80216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (79) etching silicon containing substrate (80) silicon containing substrate is glass
216/81216 etching a substrate: processes/(58) gas phase etching of substrate (74) etching inorganic substrate (81) etching elemental carbon containing substrate
216/83216 etching a substrate: processes/(83) nongaseous phase etching of substrate
216/84216 etching a substrate: processes/(83) nongaseous phase etching of substrate (84) with measuring, testing, or inspecting
216/85216 etching a substrate: processes/(83) nongaseous phase etching of substrate (84) with measuring, testing, or inspecting (85) by optical means or of an optical property
216/86216 etching a substrate: processes/(83) nongaseous phase etching of substrate (84) with measuring, testing, or inspecting (86) by electrical means or of an electrical property
216/87216 etching a substrate: processes/(83) nongaseous phase etching of substrate (87) irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to ethching to change properties of substrate toward the etchant
216/88216 etching a substrate: processes/(83) nongaseous phase etching of substrate (88) using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)
216/89216 etching a substrate: processes/(83) nongaseous phase etching of substrate (88) using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.) (89) etchant contains solid particle (e.g., abrasive for polishing, etc.)
216/90216 etching a substrate: processes/(83) nongaseous phase etching of substrate (90) relative movement between the substrate and a confined pool of etchant
216/91216 etching a substrate: processes/(83) nongaseous phase etching of substrate (90) relative movement between the substrate and a confined pool of etchant (91) rotating, repeated dipping, or advancing movement of substrate
216/92216 etching a substrate: processes/(83) nongaseous phase etching of substrate (92) projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate
216/93216 etching a substrate: processes/(83) nongaseous phase etching of substrate (93) recycling, regenerating, or rejunevating etchant
216/94216 etching a substrate: processes/(83) nongaseous phase etching of substrate (94) etching using radiation (e.g., laser, electron-beam, ion-beam, etc.)
216/95216 etching a substrate: processes/(83) nongaseous phase etching of substrate (95) substrate is multilayered
216/96216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate
216/97216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (97) substrate is glass
216/98216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (97) substrate is glass (98) frosting glass
216/99216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (99) substrate contains silicon or silicon compound
216/100216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound
216/101216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (101) etching of a compound containing at least one oxygen atom and at least one metal atom
216/102216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (102) metal is elemental aluminum, an alloy, or compound thereof
216/103216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (102) metal is elemental aluminum, an alloy, or compound thereof (103) etchant contains acid
216/104216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (102) metal is elemental aluminum, an alloy, or compound thereof (103) etchant contains acid (104) etchant contains fluoride ion
216/105216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (105) metal is elemental copper, an alloy, or compound thereof
216/106216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (105) metal is elemental copper, an alloy, or compound thereof (106) etchant contains acid
216/107216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (105) metal is elemental copper, an alloy, or compound thereof (106) etchant contains acid (107) etchant contains fluoride ion
216/108216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (108) etchant contains acid
216/109216 etching a substrate: processes/(83) nongaseous phase etching of substrate (96) etching inorganic substrate (100) substrate contains elemental metal, alloy thereof, or metal compound (108) etchant contains acid (109) etchant contains fluoride ion

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