USPC Class Details

Description: 216 etching a substrate: processes / 216 etching a substrate: processes/(52) mechanically shaping, deforming, or abrading of substrate (53) nongaseous phase etching

Hierarchy/Derived subclasses

216 / 52-> 53

uspto searches

Patent Apps in 216/53

Granted Patents in 216/53

Use the links above or do an advanced search in ppubs for:
(216/53.ccls.)

This will show what classes derive from the input. Ex: entering 43/42.24 shows the derived classes and the search that can be used to find patents or patent applications in those subclasses.
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